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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 panel
fiyat:	Anlaşılabilir
Payment Terms:	T/T

Detail Information

Ürün Açıklaması

Detail Information

Place of Origin:

China

Sertifika:

ISO9001, ISO13485,IS014001

Yönetim kurulu türü:

6 kat

Temel Malzeme:

FR4/ROGERS/Yüksek Tg

Lehim maskesi:

Yeşil lehim maskesi

Minimum Lehim Maskesi Köprüsü:

0,1 mm

Yüzey İşlemi:

EING

Hizmet türü:

PCB Prototipi/Kütle üretimi

Boyut:

Özelleştirilmiş

CU kalınlığı:

1 oz

Maksimum substrat boyutu:

24 ”x32”

Ambalaj bilgileri:

Vakum paketi

Vurgulamak:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Ürün Açıklaması

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Etiketler:

Esnek PCB Kartı

sert pcb

Bakır PCB

Sert Esnek PCB

Alüminyum PCB Kartı

HDI PCB'si

Ağır Bakır PCB

Rogers pcb'si

LED PCB Kartı

Güç PCB Montajı

PCB Sargısı

Hızlı Dönüş PCB'si

Yüksek Frekanslı PCB

EMS PCB Montajı

Esnek PCB Kartı

sert pcb

Bakır PCB

Sert Esnek PCB

Alüminyum PCB Kartı

HDI PCB'si

Ağır Bakır PCB

Rogers pcb'si

LED PCB Kartı

Güç PCB Montajı

PCB Sargısı

Hızlı Dönüş PCB'si

Yüksek Frekanslı PCB

EMS PCB Montajı

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements